Adlink CoreModule 745 Manual de usuario descargar pdf (Pagina 2)

Notice Page

DISCLAIMER

ADLINK Technology, Incorporated makes no representations or warranties with respect to the contents of

this manual or of the associated ADLINK products, and specifically disclaims any implied warranties of

merchantability or fitness for any particular purpose. ADLINK shall under no circumstances be liable for

incidental or consequential damages or related expenses resulting from the use of this product, even if it has

been notified of the possibility of such damages. ADLINK reserves the right to revise this publication from

time to time without obligation to notify any person of such revisions. If errors are found, please contact

ADLINK at the address shown at the bottom of this page.

Audience

This manual provides reference only for computer design engineers, including but not limited to hardware

and software designers and applications engineers. ADLINK Technology, Inc. assumes you are qualified to

design and implement prototype computer equipment.

ii Reference Manual CoreModule 745

TRADEMARKS

CoreModule and the Ampro logo are registered trademarks, and ADLINK, Little Board, LittleBoard,

MightyBoard, MightySystem, MilSystem, MiniModule, ReadyBoard, ReadyBox, ReadyPanel,

ReadySystem, and RuffSystem are trademarks of ADLINK Technology, Inc. All other marks are the

property of their respective companies.

REVISION HISTORY

ADLINK Technology, Incorporated

5215 Hellyer Avenue, #110

San Jose, CA 95138-1007

Tel. 408 360-0200

Fax 408 360-0222

www.adlinktech.com

Revision Reason for Change Date

1000 Initial Release Nov/10

1010 Replaced N450, D410, and D510 CPUs with N455 and D525; added

JP3 and JP4 to Table 2-3 and removed JP1 (CMOS reset); changed

J10 to J19 in Table 3-10 caption; revised Table 3-9 caption to J10;

revised voltage of battery in Table 3-17 from 5V to 3.3V; changed

width in Table 2-4 from 3.76" to 3.8"; added heatsink dwg and table;

changed pitch in Table 3-15 to 0.079"; revised Ethernet Interface

description on page 27; added Gb Ethernet controller to table

Table 3-14; revised Appendix A address information

Mar/12

1020 Added airflow diagrams to “Thermal/Cooling Requirements” on

page 16; added details to descriptions of Copper and Aluminum

heatsink qualifications in Table 2-7; changed Serial Console to

Remote Access in Chapter 3; changed voltage of battery header to

+3.0; updated contact addresses in Appendix A

Oct/13

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